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309.60 EUR
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BS IEC 60747-18-1:2019
Semiconductor devices Semiconductor bio sensors. Test method and data analysis for calibration of lens-free CMOS photonic array sensors
Semiconductor devices Semiconductor bio sensors. Test method and data analysis for calibration of lens-free CMOS photonic array sensors
Released: 2019-06-07
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264.00 EUR
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BS IEC 62951-6:2019
Semiconductor devices. Flexible and stretchable semiconductor devices Test method for sheet resistance of flexible conducting films
Semiconductor devices. Flexible and stretchable semiconductor devices Test method for sheet resistance of flexible conducting films
Released: 2019-05-15
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BS IEC 60747-5-8:2019
Semiconductor devices Optoelectronic devices. Light emitting diodes. Test method of optoelectronic efficiencies of light emitting diodes
Semiconductor devices Optoelectronic devices. Light emitting diodes. Test method of optoelectronic efficiencies of light emitting diodes
Released: 2019-11-27
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BS IEC 60747-5-11:2019
Semiconductor devices Optoelectronic devices. Light emitting diodes. Test method of radiative and nonradiative currents of light emitting diodes
Semiconductor devices Optoelectronic devices. Light emitting diodes. Test method of radiative and nonradiative currents of light emitting diodes
Released: 2020-01-14
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BS IEC 62047-40:2021
Semiconductor devices. Micro-electromechanical devices Test methods of micro-electromechanical inertial shock switch threshold
Semiconductor devices. Micro-electromechanical devices Test methods of micro-electromechanical inertial shock switch threshold
Released: 2021-09-14
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160.80 EUR
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PD IEC TS 60747-19-2:2021
Semiconductor devices Smart sensors. Indication of specifications of sensors and power supplies to drive smart sensors for low power operation
Semiconductor devices Smart sensors. Indication of specifications of sensors and power supplies to drive smart sensors for low power operation
Released: 2021-07-02
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BS IEC 62047-38:2021
Semiconductor devices. Micro-electromechanical devices Test method for adhesion strength of metal powder paste in MEMS interconnection
Semiconductor devices. Micro-electromechanical devices Test method for adhesion strength of metal powder paste in MEMS interconnection
Released: 2021-07-07
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309.60 EUR
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BS IEC 62047-48:2024
Semiconductor devices. Micro-electromechanical devices Test method for determining solution concentration by optical absorption using MEMS fluidic device
Semiconductor devices. Micro-electromechanical devices Test method for determining solution concentration by optical absorption using MEMS fluidic device
Released: 2024-06-11
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