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31.080.01 Semiconductor devices in general
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BS EN IEC 60749-12:2018
Semiconductor devices. Mechanical and climatic test methods Vibration, variable frequency
Semiconductor devices. Mechanical and climatic test methods Vibration, variable frequency
Released: 2018-04-18
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155.44 EUR
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BS EN 60749-4:2017
Semiconductor devices. Mechanical and climatic test methods Damp heat, steady state, highly accelerated stress test (HAST)
Semiconductor devices. Mechanical and climatic test methods Damp heat, steady state, highly accelerated stress test (HAST)
Released: 2017-11-28
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183.28 EUR
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183.28 EUR
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183.28 EUR
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183.28 EUR
BS EN 60191-6-10:2003
Mechanical standardization of semiconductor devices General rules for the preparation of outline drawings of surface mounted semiconductor device packages
Mechanical standardization of semiconductor devices General rules for the preparation of outline drawings of surface mounted semiconductor device packages
Released: 2004-03-31
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BS EN 60749-1:2003
Semiconductor devices. Mechanical and climatic test methods General
Semiconductor devices. Mechanical and climatic test methods General
Released: 2003-07-07
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BS EN 60749-11:2002
Semiconductor devices. Mechanical and climatic test methods Rapid change of temperature. Two-fluid-bath method
Semiconductor devices. Mechanical and climatic test methods Rapid change of temperature. Two-fluid-bath method
Released: 2003-10-24
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BS EN IEC 60191-1:2018
Mechanical standardization of semiconductor devices General rules for the preparation of outline drawings of discrete devices
Mechanical standardization of semiconductor devices General rules for the preparation of outline drawings of discrete devices
Released: 2018-04-30
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299.28 EUR
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BS EN 62418:2010
Semiconductor devices. Metallization stress void test
Semiconductor devices. Metallization stress void test
Released: 2010-08-31
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183.28 EUR
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183.28 EUR
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PD IEC TR 63378-1:2021
Thermal standardization on semiconductor packages Thermal resistance and thermal parameter of BGA, QFP type semiconductor packages
Thermal standardization on semiconductor packages Thermal resistance and thermal parameter of BGA, QFP type semiconductor packages
Released: 2022-01-11
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255.20 EUR
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BS EN IEC 60749-28:2022
Semiconductor devices. Mechanical and climatic test methods Electrostatic discharge (ESD) sensitivity testing. Charged device model (CDM). device level
Semiconductor devices. Mechanical and climatic test methods Electrostatic discharge (ESD) sensitivity testing. Charged device model (CDM). device level
Released: 2022-09-06
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354.96 EUR
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354.96 EUR
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257.52 EUR
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257.52 EUR