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31.080.01 Semiconductor devices in general
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24/30495067 DC
BS EN 60601-2-93 Medical electrical equipment Part 2-93: Particular requirements for the basic safety and essential performance of neutron capture therapy equipment
BS EN 60601-2-93 Medical electrical equipment Part 2-93: Particular requirements for the basic safety and essential performance of neutron capture therapy equipment
Released: 2024-06-14
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BS EN IEC 60749-37:2022 - TC
Tracked Changes. Semiconductor devices. Mechanical and climatic test methods Board level drop test method using an accelerometer
Tracked Changes. Semiconductor devices. Mechanical and climatic test methods Board level drop test method using an accelerometer
Released: 2022-12-20
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BS EN IEC 63287-1:2021
Semiconductor devices. Generic semiconductor qualification guidelines Guidelines for IC reliability qualification
Semiconductor devices. Generic semiconductor qualification guidelines Guidelines for IC reliability qualification
Released: 2021-11-30
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414.00 USD
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BS EN IEC 60749-10:2022
Semiconductor devices. Mechanical and climatic test methods Mechanical shock. device and subassembly
Semiconductor devices. Mechanical and climatic test methods Mechanical shock. device and subassembly
Released: 2022-08-16
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224.59 USD
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BS IEC 63378-2-1:2024
Thermal standardization on semiconductor packages 3D thermal simulation models of semiconductor packages for steady-state analysis. Discrete packages
Thermal standardization on semiconductor packages 3D thermal simulation models of semiconductor packages for steady-state analysis. Discrete packages
Released: 2024-10-29
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26/30559865 DC
Draft BS IEC 63551-1 Semiconductor devices. Chip-scale testing for autonomous vehicles Part 1: Combined LD-PD for LiDAR
Draft BS IEC 63551-1 Semiconductor devices. Chip-scale testing for autonomous vehicles Part 1: Combined LD-PD for LiDAR
Released: 2026-04-15
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BS EN IEC 60749-22-1:2026
Semiconductor devices — Mechanical and climatic test methods Bond strength — wire bond pull test methods
Semiconductor devices — Mechanical and climatic test methods Bond strength — wire bond pull test methods
Released: 2026-01-21
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435.65 USD
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26/30564419 DC
BS EN IEC 63551-2 Semiconductor devices - Chip-scale testing for autonomous vehicles Part 2: Optical performance of LiDAR
BS EN IEC 63551-2 Semiconductor devices - Chip-scale testing for autonomous vehicles Part 2: Optical performance of LiDAR
Released: 2026-05-29
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BS EN IEC 60749-23:2026
Semiconductor devices. Mechanical and climatic test methods High temperature operating life
Semiconductor devices. Mechanical and climatic test methods High temperature operating life
Released: 2026-02-03
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192.12 USD
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BS EN IEC 60749-24:2026 - TC
Tracked Changes. Semiconductor devices. Mechanical and climatic test methods Accelerated moisture resistance. Unbiased HAST
Tracked Changes. Semiconductor devices. Mechanical and climatic test methods Accelerated moisture resistance. Unbiased HAST
Released: 2026-02-02
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316.59 USD
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26/30553853 DC
Draft BS EN IEC 60747-5-6/AMD1 ED2 Amendment 1 - Semiconductor devices
Draft BS EN IEC 60747-5-6/AMD1 ED2 Amendment 1 - Semiconductor devices
Released: 2026-01-27
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