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31.080.01 Semiconductor devices in general
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BS EN 62374:2007
Semiconductor devices. Time dependent dielectric breakdown (TDDB) test for gate dielectric films
Semiconductor devices. Time dependent dielectric breakdown (TDDB) test for gate dielectric films
Released: 2008-10-31
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311.15 USD
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BS EN 60749-11:2002
Semiconductor devices. Mechanical and climatic test methods Rapid change of temperature. Two-fluid-bath method
Semiconductor devices. Mechanical and climatic test methods Rapid change of temperature. Two-fluid-bath method
Released: 2003-10-24
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190.45 USD
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BS EN IEC 60191-1:2018
Mechanical standardization of semiconductor devices General rules for the preparation of outline drawings of discrete devices
Mechanical standardization of semiconductor devices General rules for the preparation of outline drawings of discrete devices
Released: 2018-04-30
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364.80 USD
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364.80 USD
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222.64 USD
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BS EN 60749-40:2011
Semiconductor devices. Mechanical and climatic test methods Board level drop test method using a strain gauge
Semiconductor devices. Mechanical and climatic test methods Board level drop test method using a strain gauge
Released: 2011-09-30
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BS EN 60749-14:2003
Semiconductor devices. Mechanical and climatic test methods Robustness of terminations (lead integrity)
Semiconductor devices. Mechanical and climatic test methods Robustness of terminations (lead integrity)
Released: 2003-12-15
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BS EN 62418:2010
Semiconductor devices. Metallization stress void test
Semiconductor devices. Metallization stress void test
Released: 2010-08-31
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BS EN IEC 60749-28:2022
Semiconductor devices. Mechanical and climatic test methods Electrostatic discharge (ESD) sensitivity testing. Charged device model (CDM). device level
Semiconductor devices. Mechanical and climatic test methods Electrostatic discharge (ESD) sensitivity testing. Charged device model (CDM). device level
Released: 2022-09-06
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431.86 USD
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BS EN IEC 60749-10:2022 - TC
Tracked Changes. Semiconductor devices. Mechanical and climatic test methods Mechanical shock. device and subassembly
Tracked Changes. Semiconductor devices. Mechanical and climatic test methods Mechanical shock. device and subassembly
Released: 2022-09-15
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313.84 USD
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PD IEC TR 63378-1:2021
Thermal standardization on semiconductor packages Thermal resistance and thermal parameter of BGA, QFP type semiconductor packages
Thermal standardization on semiconductor packages Thermal resistance and thermal parameter of BGA, QFP type semiconductor packages
Released: 2022-01-11
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313.84 USD
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313.84 USD
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222.64 USD
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222.64 USD