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31.080.01 Semiconductor devices in general
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BS IEC 60191-2:1966+A21:2020
Mechanical standardization of semiconductor devices Dimensions
Mechanical standardization of semiconductor devices Dimensions
Released: 2020-04-02
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369.60 EUR
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BS EN IEC 60749-37:2022
Semiconductor devices. Mechanical and climatic test methods Board level drop test method using an accelerometer
Semiconductor devices. Mechanical and climatic test methods Board level drop test method using an accelerometer
Released: 2022-11-22
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246.40 EUR
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BS EN IEC 62007-1:2015+A1:2022
Semiconductor optoelectronic devices for fibre optic system applications Specification template for essential ratings and characteristics
Semiconductor optoelectronic devices for fibre optic system applications Specification template for essential ratings and characteristics
Released: 2022-11-24
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288.96 EUR
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288.96 EUR
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176.96 EUR
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176.96 EUR
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481.60 EUR
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481.60 EUR
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176.96 EUR
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BS IEC 60747-9:2019
Semiconductor devices Discrete devices. Insulated-gate bipolar transistors (IGBTs)
Semiconductor devices Discrete devices. Insulated-gate bipolar transistors (IGBTs)
Released: 2019-11-22
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22.40 EUR
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BS EN IEC 60749-5:2024 - TC
Tracked Changes. Semiconductor devices. Mechanical and climatic test methods Steady-state temperature humidity bias life test
Tracked Changes. Semiconductor devices. Mechanical and climatic test methods Steady-state temperature humidity bias life test
Released: 2024-02-09
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24/30501951 DC
BS EN IEC 60749-26 Semiconductor devices - Mechanical and climatic test methods Part 26: Electrostatic discharge (ESD) sensitivity testing - Human body model (HBM)
BS EN IEC 60749-26 Semiconductor devices - Mechanical and climatic test methods Part 26: Electrostatic discharge (ESD) sensitivity testing - Human body model (HBM)
Released: 2024-11-29
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24/30502824 DC
BS EN IEC 60749-22-1 Semiconductor devices - Mechanical and climatic test methods Part 22-1: Bond strength - wire bond pull test methods
BS EN IEC 60749-22-1 Semiconductor devices - Mechanical and climatic test methods Part 22-1: Bond strength - wire bond pull test methods
Released: 2024-12-13
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25/30510337 DC
Draft BS EN 63378-4 Thermal standardization on semiconductor packages Part 4. Thermal evaluation board specifications for fine pitch semiconductor packages
Draft BS EN 63378-4 Thermal standardization on semiconductor packages Part 4. Thermal evaluation board specifications for fine pitch semiconductor packages
Released: 2025-03-04
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