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31.080.01 Semiconductor devices in general
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BS IEC 62779-4:2020
Semiconductor devices. Semiconductor interface for human body communication Capsule endoscope
Semiconductor devices. Semiconductor interface for human body communication Capsule endoscope
Released: 2020-07-17
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176.96 EUR
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BS IEC 60191-2:1966+A21:2020
Mechanical standardization of semiconductor devices Dimensions
Mechanical standardization of semiconductor devices Dimensions
Released: 2020-04-02
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369.60 EUR
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BS EN IEC 60749-15:2020
Semiconductor devices. Mechanical and climatic test methods Resistance to soldering temperature for through-hole mounted devices
Semiconductor devices. Mechanical and climatic test methods Resistance to soldering temperature for through-hole mounted devices
Released: 2020-10-01
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BS EN IEC 60749-30:2020
Semiconductor devices. Mechanical and climatic test methods Preconditioning of non-hermetic surface mount devices prior to reliability testing
Semiconductor devices. Mechanical and climatic test methods Preconditioning of non-hermetic surface mount devices prior to reliability testing
Released: 2020-09-30
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BS EN IEC 60749-37:2022
Semiconductor devices. Mechanical and climatic test methods Board level drop test method using an accelerometer
Semiconductor devices. Mechanical and climatic test methods Board level drop test method using an accelerometer
Released: 2022-11-22
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246.40 EUR
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BS EN IEC 62007-1:2015+A1:2022
Semiconductor optoelectronic devices for fibre optic system applications Specification template for essential ratings and characteristics
Semiconductor optoelectronic devices for fibre optic system applications Specification template for essential ratings and characteristics
Released: 2022-11-24
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288.96 EUR
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288.96 EUR
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176.96 EUR
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176.96 EUR
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481.60 EUR
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25/30510337 DC
Draft BS EN 63378-4 Thermal standardization on semiconductor packages Part 4. Thermal evaluation board specifications for fine pitch semiconductor packages
Draft BS EN 63378-4 Thermal standardization on semiconductor packages Part 4. Thermal evaluation board specifications for fine pitch semiconductor packages
Released: 2025-03-04
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22.40 EUR
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22.40 EUR
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24/30501951 DC
BS EN IEC 60749-26 Semiconductor devices - Mechanical and climatic test methods Part 26: Electrostatic discharge (ESD) sensitivity testing - Human body model (HBM)
BS EN IEC 60749-26 Semiconductor devices - Mechanical and climatic test methods Part 26: Electrostatic discharge (ESD) sensitivity testing - Human body model (HBM)
Released: 2024-11-29
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24/30502824 DC
BS EN IEC 60749-22-1 Semiconductor devices - Mechanical and climatic test methods Part 22-1: Bond strength - wire bond pull test methods
BS EN IEC 60749-22-1 Semiconductor devices - Mechanical and climatic test methods Part 22-1: Bond strength - wire bond pull test methods
Released: 2024-12-13
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