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>BSI Standards >31 ELECTRONICS>31.180 Printed circuits and boards

31.180 Printed circuits and boards

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258 results
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BS EN IEC 61189-2-804:2023
Test methods for electrical materials, printed board and other interconnection structures and assemblies Test methods for time to delamination. T260, T288, T300
Released: 2023-12-25
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BS IEC 62899-202-10:2023
Printed electronics Materials. Resistance measurement method for thermoformable conducting layer
Released: 2023-08-23
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BS EN IEC 62496-2-5:2022
Optical circuit boards. Basic test and measurement procedures Flexibility test for flexible opto-electric circuits
Released: 2023-01-26
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BS EN IEC 63203-402-1:2022
Wearable electronic devices and technologies Performance measurement of fitness wearables. Test methods of glove-type motion sensors for measuring finger movements
Released: 2023-01-20
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23/30474278 DC
BS EN IEC 63267-3-61. Fibre optic interconnecting devices and passive components. Fibre optic connector optical interfaces for enhanced macrobend multimode fibres Part 3-61. Connector parameters of physically contacting 50 μm core diameter fibres. Non-angled 2,5 mm and 1,25 mm diameter cylindrical full zirconia ferrules for reference connection applications
Released: 2023-05-26
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BS EN IEC 61249-2-53:2025
Materials for printed boards and other interconnecting structures Reinforced base materials clad and unclad — PTFE unfilled laminate sheets of defined flammability (vertical burning test), copper-clad
Released: 2025-12-02
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BS EN IEC 61189-3-302:2025
Test methods for electrical materials, printed boards and other interconnection structures and assemblies Detection of plating defects in unpopulated circuit boards by computed tomography (CT)
Released: 2025-12-02
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BS EN IEC 61249-2-52:2025
Materials for printed boards and other interconnecting structures Part 2-52: Reinforced base materials clad and unclad - Thermosetting hydrocarbon resin system, woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad
Released: 2025-11-11
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BS EN 61189-2:2006
Test methods for electrical materials, printed boards and other interconnection structures and assemblies Test methods for materials for interconnection structures
Released: 2006-11-30
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389.76 EUR
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BS IEC 62899-302-2:2018
Printed electronics Equipment. Inkjet. Imaging-based measurement of droplet volume
Released: 2018-05-18
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BS CECC 23600-801:1998
Harmonized system of quality assessment for electronic components. Capability detail specification: flex-rigid multilayer printed boards with through connections
Released: 1998-06-15
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PD IEC/TR 63018:2015
Flexible printed circuit boards (FPCBs). Method to decrease signal loss by using noise suppression materials
Released: 2015-12-16
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185.92 EUR
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258 results
First page123578...202122Last page