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31.180 Printed circuits and boards
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BS EN IEC 63251:2023
Test method for mechanical properties of flexible opto-electric circuit boards under thermal stress
Test method for mechanical properties of flexible opto-electric circuit boards under thermal stress
Released: 2023-12-19
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259.84 EUR
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259.84 EUR
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159.04 EUR
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159.04 EUR
BS IEC 62899-202-7:2021
Printed electronics Materials. Printed film. Measurement of peel strength for printed layer on flexible substrate by the 90° peel method
Printed electronics Materials. Printed film. Measurement of peel strength for printed layer on flexible substrate by the 90° peel method
Released: 2021-03-11
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185.92 EUR
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BS EN IEC 62496-2-5:2022
Optical circuit boards. Basic test and measurement procedures Flexibility test for flexible opto-electric circuits
Optical circuit boards. Basic test and measurement procedures Flexibility test for flexible opto-electric circuits
Released: 2023-01-26
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259.84 EUR
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259.84 EUR
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259.84 EUR
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259.84 EUR
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259.84 EUR
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259.84 EUR
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246.40 EUR
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246.40 EUR
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246.40 EUR
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246.40 EUR
PD IEC/PAS 61182-12:2014
Generic requirements for printed board assembly products manufacturing description data and transfer methodology
Generic requirements for printed board assembly products manufacturing description data and transfer methodology
Released: 2014-10-31
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389.76 EUR
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389.76 EUR
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389.76 EUR
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389.76 EUR
BS IEC 62899-302-2:2018
Printed electronics Equipment. Inkjet. Imaging-based measurement of droplet volume
Printed electronics Equipment. Inkjet. Imaging-based measurement of droplet volume
Released: 2018-05-18
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185.92 EUR
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185.92 EUR
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259.84 EUR
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259.84 EUR