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>BSI Standards >31 ELECTRONICS>31.180 Printed circuits and boards

31.180 Printed circuits and boards

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256 results
First page123578...202122Last page
BS IEC 62899-202-10:2023
Printed electronics Materials. Resistance measurement method for thermoformable conducting layer
Released: 2023-08-23
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246.40 EUR
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246.40 EUR
BS EN IEC 61189-2-803:2023
Test methods for electrical materials, printed boards and other interconnection structures and assemblies Test methods for Z-axis expansion of base materials and printed boards
Released: 2023-09-13
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150.08 EUR
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150.08 EUR
23/30474278 DC
BS EN IEC 63267-3-61. Fibre optic interconnecting devices and passive components. Fibre optic connector optical interfaces for enhanced macrobend multimode fibres Part 3-61. Connector parameters of physically contacting 50 μm core diameter fibres. Non-angled 2,5 mm and 1,25 mm diameter cylindrical full zirconia ferrules for reference connection applications
Released: 2023-05-26
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22.40 EUR
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22.40 EUR
BS EN IEC 61189-2-807:2021
Test methods for electrical materials, printed boards and other interconnection structures and assemblies Test methods for materials for interconnection structures. Decomposition temperature (<i>T</i><sub>d</sub>) using TGA
Released: 2021-11-05
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150.08 EUR
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24/30493202 DC
BS IEC 62899-403-2 Printed electronics Part 403-2: Printability - Requirements for reproducibility - Basic patterns for printing plate
Released: 2024-05-10
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22.40 EUR
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22.40 EUR
BS EN IEC 63203-301-1:2024
Wearable electronic devices and technologies Test method of electrochromic films for wearable equipment
Released: 2024-05-09
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176.96 EUR
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176.96 EUR
PD IEC/PAS 61182-12:2014
Generic requirements for printed board assembly products manufacturing description data and transfer methodology
Released: 2014-10-31
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369.60 EUR
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369.60 EUR
BS EN 61189-2:2006
Test methods for electrical materials, printed boards and other interconnection structures and assemblies Test methods for materials for interconnection structures
Released: 2006-11-30
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369.60 EUR
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369.60 EUR
BS IEC 62899-302-2:2018
Printed electronics Equipment. Inkjet. Imaging-based measurement of droplet volume
Released: 2018-05-18
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176.96 EUR
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176.96 EUR
BS EN 123300:1992
Specification for harmonized system of quality assessment for electronic components. Sectional specification. Multilayer printed boards
Released: 1989-08-31
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288.96 EUR
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288.96 EUR
BS EN 61249-2-12:1999
Materials for interconnection structures. Sectional specification set for reinforced base materials, clad and unclad Epoxide non-woven aramid laminate of defined flammability, copper-clad
Released: 1999-06-15
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176.96 EUR
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176.96 EUR
BS EN 62326-4-1:1997
Printed boards. Rigid multilayer printed boards with interlayer connections. Sectional specification Capability detail specification. Performance levels, A, B and C
Released: 1997-06-15
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342.72 EUR
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342.72 EUR
256 results
First page123578...202122Last page