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PD IEC TR 62878-2-8:2021
Device embedding assembly technology Guidelines. Warpage control of active device embedded substrate
Device embedding assembly technology Guidelines. Warpage control of active device embedded substrate
Released: 2021-07-29
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BS IEC 62899-202-7:2021
Printed electronics Materials. Printed film. Measurement of peel strength for printed layer on flexible substrate by the 90° peel method
Printed electronics Materials. Printed film. Measurement of peel strength for printed layer on flexible substrate by the 90° peel method
Released: 2021-03-11
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PD IEC TR 61188-8:2021
Circuit boards and circuit board assemblies. Design and use 3D shape data for CAD component library
Circuit boards and circuit board assemblies. Design and use 3D shape data for CAD component library
Released: 2021-01-22
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BS EN IEC 62496-2-5:2022
Optical circuit boards. Basic test and measurement procedures Flexibility test for flexible opto-electric circuits
Optical circuit boards. Basic test and measurement procedures Flexibility test for flexible opto-electric circuits
Released: 2023-01-26
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255.20 EUR
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255.20 EUR
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255.20 EUR
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255.20 EUR
English Secure PDF
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155.44 EUR
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155.44 EUR
English Secure PDF
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255.20 EUR
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255.20 EUR
BS EN 61191-6:2010
Printed board assemblies Evaluation criteria for voids in soldered joints of BGA and LGA and measurement methods
Printed board assemblies Evaluation criteria for voids in soldered joints of BGA and LGA and measurement methods
Released: 2010-05-31
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BS 123800-003:2001
System of quality assessment. Capability detail specification. Flexible multilayer printed boards with through-connections
System of quality assessment. Capability detail specification. Flexible multilayer printed boards with through-connections
Released: 2001-12-17
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255.20 EUR
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BS EN 61188-5-4:2007
Printed boards and printed board assemblies. Design and use Attachments (land/joint) considerations. Components with J leads on two sides
Printed boards and printed board assemblies. Design and use Attachments (land/joint) considerations. Components with J leads on two sides
Released: 2007-12-31
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BS EN 123500-800:1992
Harmonized system of quality assessment for electronic components. Capability detail specification: flexible printed boards with through-connections
Harmonized system of quality assessment for electronic components. Capability detail specification: flexible printed boards with through-connections
Released: 1991-12-20
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BS 123200-003:2001
System of quality assessment. Capability detail specification. Rigid double-sided printed boards with plated-through holes
System of quality assessment. Capability detail specification. Rigid double-sided printed boards with plated-through holes
Released: 2001-12-17
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