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BS EN 62258-6:2006
Semiconductor die products Requirements for information concerning thermal simulation
Semiconductor die products Requirements for information concerning thermal simulation
Released: 2006-11-30
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154.10 EUR
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154.10 EUR
BS EN 62258-1:2010
Semiconductor die products Procurement and use
Semiconductor die products Procurement and use
Released: 2010-11-30
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333.50 EUR
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333.50 EUR
BS EN 62047-20:2014
Semiconductor devices. Micro-electromechanical devices Gyroscopes
Semiconductor devices. Micro-electromechanical devices Gyroscopes
Released: 2014-10-31
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351.90 EUR
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351.90 EUR
BS EN 62047-4:2010
Semiconductor devices. Micro-electromechanical devices Generic specification for MEMS
Semiconductor devices. Micro-electromechanical devices Generic specification for MEMS
Released: 2010-11-30
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253.00 EUR
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253.00 EUR
BS IEC 62047-32:2019
Semiconductor devices. Micro-electromechanical devices Test method for the nonlinear vibration of MEMS resonators
Semiconductor devices. Micro-electromechanical devices Test method for the nonlinear vibration of MEMS resonators
Released: 2019-01-29
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181.70 EUR
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181.70 EUR
BS IEC 60747-14-3:2009
Semiconductor devices Semiconductor sensors. Pressure sensors
Semiconductor devices Semiconductor sensors. Pressure sensors
Released: 2009-07-31
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253.00 EUR
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BS EN IEC 62969-3:2018
Semiconductor devices. Semiconductor interface for automotive vehicles Shock driven piezoelectric energy harvesting for automotive vehicle sensors
Semiconductor devices. Semiconductor interface for automotive vehicles Shock driven piezoelectric energy harvesting for automotive vehicle sensors
Released: 2018-06-28
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253.00 EUR
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BS EN 62830-3:2017
Semiconductor devices. Semiconductor devices for energy harvesting and generation Vibration based electromagnetic energy harvesting
Semiconductor devices. Semiconductor devices for energy harvesting and generation Vibration based electromagnetic energy harvesting
Released: 2017-04-30
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253.00 EUR
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253.00 EUR
BS EN 62047-2:2006
Semiconductor devices. Micro-electromechanical devices Tensile testing method of thin film materials
Semiconductor devices. Micro-electromechanical devices Tensile testing method of thin film materials
Released: 2006-11-30
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181.70 EUR
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181.70 EUR
BS IEC 63068-1:2019
Semiconductor devices. Non-destructive recognition criteria of defects in silicon carbide homoepitaxial wafer for power devices Classification of defects
Semiconductor devices. Non-destructive recognition criteria of defects in silicon carbide homoepitaxial wafer for power devices Classification of defects
Released: 2019-05-10
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253.00 EUR
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253.00 EUR
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181.70 EUR
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181.70 EUR
BS EN 62047-17:2015
Semiconductor devices. Micro-electromechanical devices Bulge test method for measuring mechanical properties of thin films
Semiconductor devices. Micro-electromechanical devices Bulge test method for measuring mechanical properties of thin films
Released: 2015-07-31
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296.70 EUR
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296.70 EUR