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BS IEC 62830-7:2021
Semiconductor devices. Semiconductor devices for energy harvesting and generation Linear sliding mode triboelectric energy harvesting
Semiconductor devices. Semiconductor devices for energy harvesting and generation Linear sliding mode triboelectric energy harvesting
Released: 2023-07-07
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BS IEC 62047-45:2025
Semiconductor devices. Micro-electromechanical devices Silicon based MEMS fabrication technology. Measurement method of impact resistance of nanostructures
Semiconductor devices. Micro-electromechanical devices Silicon based MEMS fabrication technology. Measurement method of impact resistance of nanostructures
Released: 2025-04-01
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BS IEC 62047-28:2017
Semiconductor devices. Micro-electromechanical devices Performance testing method of vibration-driven MEMS electret energy harvesting devices
Semiconductor devices. Micro-electromechanical devices Performance testing method of vibration-driven MEMS electret energy harvesting devices
Released: 2020-07-22
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BS EN 62047-8:2011
Semiconductor devices. Micro-electromechanical devices Strip bending test method for tensile property measurement of thin films
Semiconductor devices. Micro-electromechanical devices Strip bending test method for tensile property measurement of thin films
Released: 2011-06-30
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PD IEC/TR 62258-8:2008
Semiconductor die products EXPRESS model schema for data exchange
Semiconductor die products EXPRESS model schema for data exchange
Released: 2008-09-30
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BS EN 62047-12:2011
Semiconductor devices. Micro-electromechanical devices Bending fatigue testing method of thin film materials using resonant vibration of MEMS structures
Semiconductor devices. Micro-electromechanical devices Bending fatigue testing method of thin film materials using resonant vibration of MEMS structures
Released: 2011-11-30
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BS EN 62258-5:2006
Semiconductor die products Requirements for information concerning electrical simulation
Semiconductor die products Requirements for information concerning electrical simulation
Released: 2006-11-30
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BS IEC 62047-31:2019
Semiconductor devices. Micro-electromechanical devices Four-point bending test method for interfacial adhesion energy of layered MEMS materials
Semiconductor devices. Micro-electromechanical devices Four-point bending test method for interfacial adhesion energy of layered MEMS materials
Released: 2019-04-17
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BS IEC 62047-33:2019
Semiconductor devices. Micro-electromechanical devices MEMS piezoresistive pressure-sensitive device
Semiconductor devices. Micro-electromechanical devices MEMS piezoresistive pressure-sensitive device
Released: 2019-04-18
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BS IEC 62047-34:2019
Semiconductor devices. Micro-electromechanical devices Test methods for MEMS piezoresistive pressure-sensitive device on wafer
Semiconductor devices. Micro-electromechanical devices Test methods for MEMS piezoresistive pressure-sensitive device on wafer
Released: 2019-04-16
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