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Homepage>BSI Standards >31 ELECTRONICS>31.180 Printed circuits and boards

31.180 Printed circuits and boards

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257 results
First page124678...202122Last page
BS EN 61249-2-39:2013
Materials for printed boards and other interconnecting structures Reinforced base materials clad and unclad. High performance epoxide and non-epoxide, woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
Released: 2013-04-30
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BS 123300-003:2001
System of quality assessment. Capability detail specification. Rigid multilayer printed boards
Released: 2001-12-17
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309.60 EUR
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BS 123600-003:2001
System of quality assessment. Capability detail specification. Flex-rigid multilayer printed boards with through-connections
Released: 2001-12-17
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BS IEC 62899-204:2019
Printed electronics Materials. Insulator ink. Measurement methods of properties of insulator inks and printed insulating layers
Released: 2019-06-07
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23/30477815 DC
BS IEC 62899-302-7. Printed electronics Part 302-7. Equipment. Measurement methods for Inkjet printing dot placement evaluation for printed electronics
Released: 2023-08-02
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24.00 EUR
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BS IEC 62899-202-10:2023
Printed electronics Materials. Resistance measurement method for thermoformable conducting layer
Released: 2023-08-23
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23/30474278 DC
BS EN IEC 63267-3-61. Fibre optic interconnecting devices and passive components. Fibre optic connector optical interfaces for enhanced macrobend multimode fibres Part 3-61. Connector parameters of physically contacting 50 μm core diameter fibres. Non-angled 2,5 mm and 1,25 mm diameter cylindrical full zirconia ferrules for reference connection applications
Released: 2023-05-26
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24.00 EUR
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BS EN IEC 61189-2-803:2023
Test methods for electrical materials, printed boards and other interconnection structures and assemblies Test methods for Z-axis expansion of base materials and printed boards
Released: 2023-09-13
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160.80 EUR
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BS EN IEC 61189-2-807:2021
Test methods for electrical materials, printed boards and other interconnection structures and assemblies Test methods for materials for interconnection structures. Decomposition temperature (<i>T</i><sub>d</sub>) using TGA
Released: 2021-11-05
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BS EN IEC 63203-402-1:2022
Wearable electronic devices and technologies Performance measurement of fitness wearables. Test methods of glove-type motion sensors for measuring finger movements
Released: 2023-01-20
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264.00 EUR
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BS EN IEC 62496-2-5:2022
Optical circuit boards. Basic test and measurement procedures Flexibility test for flexible opto-electric circuits
Released: 2023-01-26
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264.00 EUR
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PD IEC TR 61188-8:2021
Circuit boards and circuit board assemblies. Design and use 3D shape data for CAD component library
Released: 2021-01-22
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189.60 EUR
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257 results
First page124678...202122Last page