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Homepage>BSI Standards >31 ELECTRONICS>31.180 Printed circuits and boards

31.180 Printed circuits and boards

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257 results
First page124678...202122Last page
PD IEC/PAS 61249-8-5:2014
Qualification and performance specification of permanent solder mask and flexible cover materials
Released: 2014-06-30
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BS 123300-003:2001
System of quality assessment. Capability detail specification. Rigid multilayer printed boards
Released: 2001-12-17
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299.28 EUR
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BS 123600-003:2001
System of quality assessment. Capability detail specification. Flex-rigid multilayer printed boards with through-connections
Released: 2001-12-17
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255.20 EUR
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255.20 EUR
BS EN 62326-1:2002
Printed boards Generic specification
Released: 2002-08-16
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354.96 EUR
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354.96 EUR
BS EN IEC 62496-2-5:2022
Optical circuit boards. Basic test and measurement procedures Flexibility test for flexible opto-electric circuits
Released: 2023-01-26
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255.20 EUR
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BS EN IEC 63203-402-1:2022
Wearable electronic devices and technologies Performance measurement of fitness wearables. Test methods of glove-type motion sensors for measuring finger movements
Released: 2023-01-20
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255.20 EUR
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PD IEC TR 61188-8:2021
Circuit boards and circuit board assemblies. Design and use 3D shape data for CAD component library
Released: 2021-01-22
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183.28 EUR
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BS EN IEC 61189-2-807:2021
Test methods for electrical materials, printed boards and other interconnection structures and assemblies Test methods for materials for interconnection structures. Decomposition temperature (<i>T</i><sub>d</sub>) using TGA
Released: 2021-11-05
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155.44 EUR
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BS EN IEC 61189-2-803:2023
Test methods for electrical materials, printed boards and other interconnection structures and assemblies Test methods for Z-axis expansion of base materials and printed boards
Released: 2023-09-13
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23/30477815 DC
BS IEC 62899-302-7. Printed electronics Part 302-7. Equipment. Measurement methods for Inkjet printing dot placement evaluation for printed electronics
Released: 2023-08-02
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23.20 EUR
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BS IEC 62899-202-10:2023
Printed electronics Materials. Resistance measurement method for thermoformable conducting layer
Released: 2023-08-23
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23/30474278 DC
BS EN IEC 63267-3-61. Fibre optic interconnecting devices and passive components. Fibre optic connector optical interfaces for enhanced macrobend multimode fibres Part 3-61. Connector parameters of physically contacting 50 μm core diameter fibres. Non-angled 2,5 mm and 1,25 mm diameter cylindrical full zirconia ferrules for reference connection applications
Released: 2023-05-26
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23.20 EUR
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257 results
First page124678...202122Last page