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31.180 Printed circuits and boards
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PD IEC/TS 62878-2-1:2015
Device embedded substrate Guidelines. General description of technology
Device embedded substrate Guidelines. General description of technology
Released: 2015-04-30
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288.96 EUR
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288.96 EUR
BS 123300-003:2001
System of quality assessment. Capability detail specification. Rigid multilayer printed boards
System of quality assessment. Capability detail specification. Rigid multilayer printed boards
Released: 2001-12-17
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288.96 EUR
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288.96 EUR
BS IEC 62899-204:2019
Printed electronics Materials. Insulator ink. Measurement methods of properties of insulator inks and printed insulating layers
Printed electronics Materials. Insulator ink. Measurement methods of properties of insulator inks and printed insulating layers
Released: 2019-06-07
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246.40 EUR
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246.40 EUR
BS 123600-003:2001
System of quality assessment. Capability detail specification. Flex-rigid multilayer printed boards with through-connections
System of quality assessment. Capability detail specification. Flex-rigid multilayer printed boards with through-connections
Released: 2001-12-17
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246.40 EUR
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246.40 EUR
PD IEC TR 61188-8:2021
Circuit boards and circuit board assemblies. Design and use 3D shape data for CAD component library
Circuit boards and circuit board assemblies. Design and use 3D shape data for CAD component library
Released: 2021-01-22
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176.96 EUR
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176.96 EUR
BS EN IEC 62496-2-5:2022
Optical circuit boards. Basic test and measurement procedures Flexibility test for flexible opto-electric circuits
Optical circuit boards. Basic test and measurement procedures Flexibility test for flexible opto-electric circuits
Released: 2023-01-26
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246.40 EUR
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246.40 EUR
English Secure PDF
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246.40 EUR
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246.40 EUR
BS EN IEC 63251:2023
Test method for mechanical properties of flexible opto-electric circuit boards under thermal stress
Test method for mechanical properties of flexible opto-electric circuit boards under thermal stress
Released: 2023-12-19
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246.40 EUR
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246.40 EUR
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150.08 EUR
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150.08 EUR
BS IEC 62899-202-7:2021
Printed electronics Materials. Printed film. Measurement of peel strength for printed layer on flexible substrate by the 90° peel method
Printed electronics Materials. Printed film. Measurement of peel strength for printed layer on flexible substrate by the 90° peel method
Released: 2021-03-11
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176.96 EUR
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PD IEC TR 62878-2-8:2021
Device embedding assembly technology Guidelines. Warpage control of active device embedded substrate
Device embedding assembly technology Guidelines. Warpage control of active device embedded substrate
Released: 2021-07-29
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176.96 EUR
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23/30477815 DC
BS IEC 62899-302-7. Printed electronics Part 302-7. Equipment. Measurement methods for Inkjet printing dot placement evaluation for printed electronics
BS IEC 62899-302-7. Printed electronics Part 302-7. Equipment. Measurement methods for Inkjet printing dot placement evaluation for printed electronics
Released: 2023-08-02
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22.40 EUR
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22.40 EUR