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31.180 Printed circuits and boards
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342.72 EUR
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342.72 EUR
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259.84 EUR
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259.84 EUR
BS 6221-6:1982
Printed wiring boards Specification for multilayer printed wiring boards
Printed wiring boards Specification for multilayer printed wiring boards
Released: 1982-01-29
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259.84 EUR
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BS IEC 62899-204:2019
Printed electronics Materials. Insulator ink. Measurement methods of properties of insulator inks and printed insulating layers
Printed electronics Materials. Insulator ink. Measurement methods of properties of insulator inks and printed insulating layers
Released: 2019-06-07
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259.84 EUR
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PD IEC TR 62878-2-8:2021
Device embedding assembly technology Guidelines. Warpage control of active device embedded substrate
Device embedding assembly technology Guidelines. Warpage control of active device embedded substrate
Released: 2021-07-29
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185.92 EUR
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185.92 EUR
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159.04 EUR
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159.04 EUR
BS IEC 62899-202-7:2021
Printed electronics Materials. Printed film. Measurement of peel strength for printed layer on flexible substrate by the 90° peel method
Printed electronics Materials. Printed film. Measurement of peel strength for printed layer on flexible substrate by the 90° peel method
Released: 2021-03-11
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PD IEC TR 61188-8:2021
Circuit boards and circuit board assemblies. Design and use 3D shape data for CAD component library
Circuit boards and circuit board assemblies. Design and use 3D shape data for CAD component library
Released: 2021-01-22
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159.04 EUR
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24/30493202 DC
BS IEC 62899-403-2 Printed electronics Part 403-2: Printability - Requirements for reproducibility - Basic patterns for printing plate
BS IEC 62899-403-2 Printed electronics Part 403-2: Printability - Requirements for reproducibility - Basic patterns for printing plate
Released: 2024-05-10
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22.40 EUR
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22.40 EUR
BS EN IEC 63203-301-1:2024
Wearable electronic devices and technologies Test method of electrochromic films for wearable equipment
Wearable electronic devices and technologies Test method of electrochromic films for wearable equipment
Released: 2024-05-09
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BS EN IEC 63251:2023
Test method for mechanical properties of flexible opto-electric circuit boards under thermal stress
Test method for mechanical properties of flexible opto-electric circuit boards under thermal stress
Released: 2023-12-19
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