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Main page>ICS codes>31 ELECTRONICS>31.080 Semiconductor devices>31.080.01 Semiconductor devices in general

31.080.01 Semiconductor devices in general

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99 results
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UNE EN 60191-6-20:2010
Mechanical standardization of semiconductor devices -- Part 6-20: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline J-lead packages (SOJ) (Endorsed by AENOR in February of 2011.)
Released: 2011-02-01
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59.40 EUR
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59.40 EUR
UNE EN 60191-6-3:2000
Mechanical standardization of semiconductor devices -- Part 6-3: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of quad flat packs (QFP) (Endorsed by AENOR in December of 2001.)
Released: 2001-12-01
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71.50 EUR
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71.50 EUR
UNE EN 60191-6-4:2003
Mechanical standardization of semiconductor devices -- Part 6-4: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of ball grid array (BGA) (Endorsed by AENOR in October of 2003.)
Released: 2003-10-01
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70.40 EUR
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UNE EN 60749-27:2006
Semiconductor devices - Mechanical and climatic test methods -- Part 27: Electrostatic discharge (ESD) sensitivity testing - Machine model (MM) (IEC 60749-27:2006) (Endorsed by AENOR in November of 2006.)
Released: 2006-11-01
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64.90 EUR
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64.90 EUR
UNE EN 60749-29:2011
Semiconductor devices - Mechanical and climatic test methods - Part 29: Latch-up test (Endorsed by AENOR in November of 2011.)
Released: 2011-11-01
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78.10 EUR
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78.10 EUR
UNE EN 60749-3:2017
Semiconductor devices - Mechanical and climatic test methods - Part 3: External visual examination (Endorsed by Asociación Española de Normalización in July of 2017.)
Released: 2017-07-01
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59.40 EUR
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59.40 EUR
UNE EN IEC 60749-10:2022
Semiconductor devices - Mechanical and climatic test methods - Part 10: Mechanical shock - device and subassembly (Endorsed by Asociación Española de Normalización in July of 2022.)
Released: 2022-07-01
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67.10 EUR
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67.10 EUR
UNE EN IEC 60749-37:2022
Semiconductor devices - Mechanical and climatic test methods - Part 37: Board level drop test method using an accelerometer (Endorsed by Asociación Española de Normalización in January of 2023.)
Released: 2023-01-01
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80.30 EUR
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80.30 EUR
UNE EN IEC 63287-2:2023
Semiconductor devices - Guidelines for reliability qualification plans - Part 2: Concept of mission profile (Endorsed by Asociación Española de Normalización in June of 2023.)
Released: 2023-06-01
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72.60 EUR
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72.60 EUR
UNE EN IEC 60749-22-2:2026
Semiconductor devices - Mechanical and climatic test methods - Part 22-2: Bond strength - Wire bond shear test methods (Endorsed by Asociación Española de Normalización in February of 2026.)
Released: 2026-02-01
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95.70 EUR
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95.70 EUR
UNE EN IEC 60749-22-1:2026
Semiconductor devices - Mechanical and climatic test methods - Part 22-1: Bond strength - Wire bond pull test methods (Endorsed by Asociación Española de Normalización in February of 2026.)
Released: 2026-02-01
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129.80 EUR
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129.80 EUR
UNE EN IEC 60749-23:2026
Semiconductor devices - Mechanical and climatic test methods - Part 23: High temperature operating life (Endorsed by Asociación Española de Normalización in March of 2026.)
Released: 2026-03-01
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61.60 EUR
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61.60 EUR
99 results
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