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31.080.01 Semiconductor devices in general
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UNE EN 60749-11:2003
Semiconductor devices - Mechanical and climatic test methods -- Part 11: Rapid change of temperature - Two-fluid-bath method.
Semiconductor devices - Mechanical and climatic test methods -- Part 11: Rapid change of temperature - Two-fluid-bath method.
Released: 2003-05-30
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67.47 USD
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67.47 USD
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56.22 USD
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56.22 USD
UNE EN 60749-14:2004
Semiconductor devices - Mechanical and climatic test methods -- Part 14: Robustness of terminations (lead integrity)
Semiconductor devices - Mechanical and climatic test methods -- Part 14: Robustness of terminations (lead integrity)
Released: 2004-06-11
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88.00 USD
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88.00 USD
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73.33 USD
Spanish Hardcopy
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73.33 USD
UNE EN 60749-16:2003
Semiconductor devices. Mechanical and climatic test methods. Part 16: Particle impact noise detection (PIND)
Semiconductor devices. Mechanical and climatic test methods. Part 16: Particle impact noise detection (PIND)
Released: 2003-11-21
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67.47 USD
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67.47 USD
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56.22 USD
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56.22 USD
UNE EN 60749-19:2003
Semiconductor devices - Mechanical and climatic test methods -- Part 19: Die shear strength
Semiconductor devices - Mechanical and climatic test methods -- Part 19: Die shear strength
Released: 2003-11-21
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49.87 USD
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49.87 USD
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41.56 USD
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41.56 USD
UNE EN 60749-19:2003/A1:2011
Semiconductor devices - Mechanical and climatic test methods -- Part 19: Die shear strength
Semiconductor devices - Mechanical and climatic test methods -- Part 19: Die shear strength
Released: 2011-01-19
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39.60 USD
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39.60 USD
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33.00 USD
Spanish Hardcopy
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33.00 USD
UNE EN 60749-1:2004
Semiconductor devices - Mechanical and climatic test methods -- Part 1: General
Semiconductor devices - Mechanical and climatic test methods -- Part 1: General
Released: 2004-05-28
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71.87 USD
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71.87 USD
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59.89 USD
Spanish Hardcopy
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59.89 USD
English PDF
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121.00 USD
English Hardcopy
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121.00 USD
UNE EN 60749-21:2011
Semiconductor devices - Mechanical and climatic test methods - Part 21: Solderability (Endorsed by AENOR in November of 2011.)
Semiconductor devices - Mechanical and climatic test methods - Part 21: Solderability (Endorsed by AENOR in November of 2011.)
Released: 2011-11-01
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83.11 USD
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83.11 USD
UNE EN 60749-22:2004
Semiconductor devices - Mechanical and climatic test methods -- Part 22: Bond strength
Semiconductor devices - Mechanical and climatic test methods -- Part 22: Bond strength
Released: 2004-03-26
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99.73 USD
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99.73 USD
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83.11 USD
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83.11 USD
UNE EN 60749-23:2005
Semiconductor devices - Mechanical and climatic test methods -- Part 23: High temperature operating life
Semiconductor devices - Mechanical and climatic test methods -- Part 23: High temperature operating life
Released: 2005-03-16
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71.87 USD
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71.87 USD
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59.89 USD
Spanish Hardcopy
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59.89 USD
UNE EN 60749-23:2005/A1:2011
Semiconductor devices - Mechanical and climatic test methods -- Part 23: High temperature operating life
Semiconductor devices - Mechanical and climatic test methods -- Part 23: High temperature operating life
Released: 2011-12-21
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39.60 USD
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39.60 USD
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33.00 USD
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33.00 USD
UNE EN 60749-24:2005
Semiconductor devices - Mechanical and climatic test methods -- Part 24: Accelerated moisture resistance - Unbiased HAST
Semiconductor devices - Mechanical and climatic test methods -- Part 24: Accelerated moisture resistance - Unbiased HAST
Released: 2005-03-16
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67.47 USD
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67.47 USD
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56.22 USD
Spanish Hardcopy
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56.22 USD