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31.080.01 Semiconductor devices in general
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UNE EN IEC 60749-21:2026
Semiconductor devices - Mechanical and climatic test methods - Part 21: Solderability (Endorsed by Asociación Española de Normalización in March of 2026.)
Semiconductor devices - Mechanical and climatic test methods - Part 21: Solderability (Endorsed by Asociación Española de Normalización in March of 2026.)
Released: 2026-03-01
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93.18 USD
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93.18 USD
UNE EN 60749-14:2004
Semiconductor devices - Mechanical and climatic test methods -- Part 14: Robustness of terminations (lead integrity)
Semiconductor devices - Mechanical and climatic test methods -- Part 14: Robustness of terminations (lead integrity)
Released: 2004-06-11
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81.53 USD
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UNE EN 60749-19:2003
Semiconductor devices - Mechanical and climatic test methods -- Part 19: Die shear strength
Semiconductor devices - Mechanical and climatic test methods -- Part 19: Die shear strength
Released: 2003-11-21
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46.59 USD
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UNE EN 60749-2:2003
Semiconductor devices - Mechanical and climatic test methods -- Part 2: Low air pressure.
Semiconductor devices - Mechanical and climatic test methods -- Part 2: Low air pressure.
Released: 2003-05-30
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53.06 USD
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UNE EN 60749-24:2005
Semiconductor devices - Mechanical and climatic test methods -- Part 24: Accelerated moisture resistance - Unbiased HAST
Semiconductor devices - Mechanical and climatic test methods -- Part 24: Accelerated moisture resistance - Unbiased HAST
Released: 2005-03-16
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62.12 USD
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62.12 USD
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UNE EN 60749-32:2004
Semiconductor devices - Mechanical and climatic test methods -- Part 32: Flammability of plastic-encapsulated devices (externally induced)
Semiconductor devices - Mechanical and climatic test methods -- Part 32: Flammability of plastic-encapsulated devices (externally induced)
Released: 2004-03-18
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UNE EN 60749-32:2004/A1:2011
Semiconductor devices - Mechanical and climatic test methods -- Part 32: Flammability of plastic-encapsulated devices (externally induced)
Semiconductor devices - Mechanical and climatic test methods -- Part 32: Flammability of plastic-encapsulated devices (externally induced)
Released: 2011-01-19
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46.59 USD
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UNE EN 60749-34:2011
Semiconductor devices - Mechanical and climatic test methods -- Part 34: Power cycling
Semiconductor devices - Mechanical and climatic test methods -- Part 34: Power cycling
Released: 2011-07-20
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78.94 USD
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78.94 USD
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78.94 USD
UNE EN 60749-36:2004
Semiconductor devices - Mechanical and climatic test methods -- Part 36: Acceleration, steady state
Semiconductor devices - Mechanical and climatic test methods -- Part 36: Acceleration, steady state
Released: 2004-03-18
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UNE EN 60191-3:2001
Mechanical standardization of semiconductor devices -- Part 3: General rules for the preparation of outline drawings of integrated circuits.
Mechanical standardization of semiconductor devices -- Part 3: General rules for the preparation of outline drawings of integrated circuits.
Released: 2001-01-31
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142.35 USD
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142.35 USD
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142.35 USD
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142.35 USD
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84.12 USD
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84.12 USD
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86.71 USD
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86.71 USD