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31.080.01 Semiconductor devices in general
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69.88 USD
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69.88 USD
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132.00 USD
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132.00 USD
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72.47 USD
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72.47 USD
UNE EN IEC 60749-21:2026
Semiconductor devices - Mechanical and climatic test methods - Part 21: Solderability (Endorsed by Asociación Española de Normalización in March of 2026.)
Semiconductor devices - Mechanical and climatic test methods - Part 21: Solderability (Endorsed by Asociación Española de Normalización in March of 2026.)
Released: 2026-03-01
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93.18 USD
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93.18 USD
UNE EN 60749-16:2003
Semiconductor devices. Mechanical and climatic test methods. Part 16: Particle impact noise detection (PIND)
Semiconductor devices. Mechanical and climatic test methods. Part 16: Particle impact noise detection (PIND)
Released: 2003-11-21
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62.12 USD
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62.12 USD
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62.12 USD
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62.12 USD
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78.94 USD
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78.94 USD
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78.94 USD
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78.94 USD
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76.35 USD
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76.35 USD
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76.35 USD
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76.35 USD
English PDF
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78.94 USD
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78.94 USD
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78.94 USD
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78.94 USD
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76.35 USD
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76.35 USD
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76.35 USD
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76.35 USD
UNE EN 60749-21:2011
Semiconductor devices - Mechanical and climatic test methods - Part 21: Solderability (Endorsed by AENOR in November of 2011.)
Semiconductor devices - Mechanical and climatic test methods - Part 21: Solderability (Endorsed by AENOR in November of 2011.)
Released: 2011-11-01
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90.59 USD
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90.59 USD
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53.06 USD
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53.06 USD
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104.82 USD
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104.82 USD