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31.080.01 Semiconductor devices in general
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73.76 USD
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73.76 USD
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116.47 USD
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116.47 USD
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95.76 USD
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95.76 USD
UNE EN 60749-21:2011
Semiconductor devices - Mechanical and climatic test methods - Part 21: Solderability (Endorsed by AENOR in November of 2011.)
Semiconductor devices - Mechanical and climatic test methods - Part 21: Solderability (Endorsed by AENOR in November of 2011.)
Released: 2011-11-01
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88.00 USD
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88.00 USD
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49.18 USD
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49.18 USD
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116.47 USD
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116.47 USD
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36.24 USD
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36.24 USD
UNE EN 60749-14:2004
Semiconductor devices - Mechanical and climatic test methods -- Part 14: Robustness of terminations (lead integrity)
Semiconductor devices - Mechanical and climatic test methods -- Part 14: Robustness of terminations (lead integrity)
Released: 2004-06-11
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93.18 USD
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93.18 USD
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77.65 USD
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77.65 USD
UNE EN 60749-19:2003
Semiconductor devices - Mechanical and climatic test methods -- Part 19: Die shear strength
Semiconductor devices - Mechanical and climatic test methods -- Part 19: Die shear strength
Released: 2003-11-21
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54.35 USD
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54.35 USD
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45.29 USD
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45.29 USD
UNE EN 60749-2:2003
Semiconductor devices - Mechanical and climatic test methods -- Part 2: Low air pressure.
Semiconductor devices - Mechanical and climatic test methods -- Part 2: Low air pressure.
Released: 2003-05-30
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62.12 USD
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62.12 USD
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51.76 USD
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51.76 USD
UNE EN 60749-24:2005
Semiconductor devices - Mechanical and climatic test methods -- Part 24: Accelerated moisture resistance - Unbiased HAST
Semiconductor devices - Mechanical and climatic test methods -- Part 24: Accelerated moisture resistance - Unbiased HAST
Released: 2005-03-16
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72.99 USD
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72.99 USD
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60.82 USD
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60.82 USD
UNE EN 60749-32:2004
Semiconductor devices - Mechanical and climatic test methods -- Part 32: Flammability of plastic-encapsulated devices (externally induced)
Semiconductor devices - Mechanical and climatic test methods -- Part 32: Flammability of plastic-encapsulated devices (externally induced)
Released: 2004-03-18
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54.35 USD
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54.35 USD
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45.29 USD
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45.29 USD