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>ICS codes>31 ELECTRONICS>31.080 Semiconductor devices>31.080.01 Semiconductor devices in general

31.080.01 Semiconductor devices in general

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UNE EN 61975:2010/A2:2022
High-voltage direct current (HVDC) installations - System tests (Endorsed by Asociación Española de Normalización in January of 2023.)
Released: 2023-01-01
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66.00 USD
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66.00 USD
UNE EN 60191-4:2014/A1:2018
Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages (Endorsed by Asociación Española de Normalización in June of 2018.)
Released: 2018-06-01
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84.12 USD
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84.12 USD
UNE EN 60191-6-13:2016
Mechanical standardization of semiconductor devices - Part 6-13: Design guideline of open-top-type sockets for Fine-pitch Ball Grid Array (FBGA) and Fine-pitch Land Grid Array (FLGA) (Endorsed by Asociación Española de Normalización in January of 2017.)
Released: 2017-01-01
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86.71 USD
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UNE EN 60191-6-18:2010
Mechanical standardization of semiconductor devices -- Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA) (Endorsed by AENOR in May of 2010.)
Released: 2010-05-01
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88.00 USD
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UNE EN 60191-6-19:2010
Mechanical standardization of semiconductor devices -- Part 6-19: Measurement methods of the package warpage at elevated temperature and the maximum permissible warpage (Endorsed by AENOR in September of 2010.)
Released: 2010-09-01
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76.35 USD
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76.35 USD
UNE EN 60191-6-22:2013
Mechanical standardization of semiconductor devices - Part 6-22: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for semiconductor packages Silicon Fine-pitch Ball Grid Array and Silicon Fine-pitch Land Grid Array (S-FBGA and S-FLGA) (Endorsed by AENOR in April of 2013.)
Released: 2013-04-01
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84.12 USD
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UNE EN 60749-20-1:2009
Semiconductor devices - Mechanical and climatic test methods -- Part 20-1: Handling, packing, labelling and shipping of surface mount devices sensitive to the combined effect of moisture and soldering heat (Endorsed by AENOR in September of 2009.)
Released: 2009-09-01
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147.53 USD
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147.53 USD
UNE EN 60749-38:2008
Semiconductor devices- Mechanical and climatic test methods- Part 38: Soft error test method for semiconductor devices with memory (Endorsed by AENOR in September of 2008.)
Released: 2008-09-01
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76.35 USD
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76.35 USD
UNE EN 60749-4:2017
Semiconductor devices - Mechanical and climatic test methods - Part 4: Damp heat, steady state, highly accelerated stress test (HAST) (Endorsed by Asociación Española de Normalización in July of 2017.)
Released: 2017-07-01
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62.12 USD
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62.12 USD
UNE EN 60749-42:2014
Semiconductor devices - Mechanical and climatic test methods - Part 42: Temperature and humidity storage (Endorsed by AENOR in November of 2014.)
Released: 2014-11-01
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62.12 USD
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62.12 USD
UNE EN 60749-44:2016
Semiconductor devices - Mechanical and climatic test methods - Part 44: Neutron beam irradiated single event effect (SEE) test method for semiconductor devices (Endorsed by AENOR in December of 2016.)
Released: 2016-12-01
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89.29 USD
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89.29 USD
UNE EN 62779-3:2016
Semiconductor devices - Semiconductor interface for human body communication - Part 3: Functional type and its operational conditions (Endorsed by AENOR in July of 2016.)
Released: 2016-07-01
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76.35 USD
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76.35 USD
99 results
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