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31.080.01 Semiconductor devices in general
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25/30513804 DC
Draft BS IEC 63581-1 Semiconductor devices. The recognition criteria of defects in polished indium phosphide wafers Part 1. Classification of defects
Draft BS IEC 63581-1 Semiconductor devices. The recognition criteria of defects in polished indium phosphide wafers Part 1. Classification of defects
Released: 2025-03-25
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BS IEC 63378-2-1:2024
Thermal standardization on semiconductor packages 3D thermal simulation models of semiconductor packages for steady-state analysis. Discrete packages
Thermal standardization on semiconductor packages 3D thermal simulation models of semiconductor packages for steady-state analysis. Discrete packages
Released: 2024-10-29
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24/30502907 DC
BS EN IEC 60749-22-2 Semiconductor devices - Mechanical and climatic test methods Part 22-2: Bond strength - Wire bond shear test methods
BS EN IEC 60749-22-2 Semiconductor devices - Mechanical and climatic test methods Part 22-2: Bond strength - Wire bond shear test methods
Released: 2024-12-13
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24/30497546 DC
BS EN IEC 60749-24 Semiconductor devices. Mechanical and climatic test methods Part 24. Accelerated moisture resistance. Unbiased HAST
BS EN IEC 60749-24 Semiconductor devices. Mechanical and climatic test methods Part 24. Accelerated moisture resistance. Unbiased HAST
Released: 2024-09-06
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24/30497538 DC
BS EN IEC 60749-7 Semiconductor devices. Mechanical and climatic test methods Part 7. Internal moisture content measurement and the analysis of other residual gases
BS EN IEC 60749-7 Semiconductor devices. Mechanical and climatic test methods Part 7. Internal moisture content measurement and the analysis of other residual gases
Released: 2024-09-06
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24/30497542 DC
BS EN IEC 60749-21 Semiconductor devices. Mechanical and climatic test methods Part 21. Solderability
BS EN IEC 60749-21 Semiconductor devices. Mechanical and climatic test methods Part 21. Solderability
Released: 2024-09-06
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BS EN IEC 63287-1:2021
Semiconductor devices. Generic semiconductor qualification guidelines Guidelines for IC reliability qualification
Semiconductor devices. Generic semiconductor qualification guidelines Guidelines for IC reliability qualification
Released: 2021-11-30
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BS EN IEC 60749-37:2022 - TC
Tracked Changes. Semiconductor devices. Mechanical and climatic test methods Board level drop test method using an accelerometer
Tracked Changes. Semiconductor devices. Mechanical and climatic test methods Board level drop test method using an accelerometer
Released: 2022-12-20
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BS EN IEC 60749-10:2022
Semiconductor devices. Mechanical and climatic test methods Mechanical shock. device and subassembly
Semiconductor devices. Mechanical and climatic test methods Mechanical shock. device and subassembly
Released: 2022-08-16
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