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BS IEC 62047-36:2019
Semiconductor devices. Micro-electromechanical devices Environmental and dielectric withstand test methods for MEMS piezoelectric thin films
Semiconductor devices. Micro-electromechanical devices Environmental and dielectric withstand test methods for MEMS piezoelectric thin films
Released: 2019-04-24
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183.28 EUR
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183.28 EUR
BS IEC 62047-30:2017
Semiconductor devices. Micro-electromechanical devices Measurement methods of electro-mechanical conversion characteristics of MEMS piezoelectric thin film
Semiconductor devices. Micro-electromechanical devices Measurement methods of electro-mechanical conversion characteristics of MEMS piezoelectric thin film
Released: 2017-10-09
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255.20 EUR
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255.20 EUR
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155.44 EUR
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155.44 EUR
BS IEC 62951-5:2019
Semiconductor devices. Flexible and stretchable semiconductor devices Test method for thermal characteristics of flexible materials
Semiconductor devices. Flexible and stretchable semiconductor devices Test method for thermal characteristics of flexible materials
Released: 2019-03-05
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183.28 EUR
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183.28 EUR
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183.28 EUR
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183.28 EUR
BS IEC 60747-5-11:2019
Semiconductor devices Optoelectronic devices. Light emitting diodes. Test method of radiative and nonradiative currents of light emitting diodes
Semiconductor devices Optoelectronic devices. Light emitting diodes. Test method of radiative and nonradiative currents of light emitting diodes
Released: 2020-01-14
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183.28 EUR
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183.28 EUR
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183.28 EUR
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183.28 EUR
BS IEC 62047-42:2022
Semiconductor devices. Micro-electromechanical devices Measurement methods of electro-mechanical conversion characteristics of piezoelectric MEMS cantilever
Semiconductor devices. Micro-electromechanical devices Measurement methods of electro-mechanical conversion characteristics of piezoelectric MEMS cantilever
Released: 2022-10-24
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255.20 EUR
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255.20 EUR
BS IEC 62047-38:2021
Semiconductor devices. Micro-electromechanical devices Test method for adhesion strength of metal powder paste in MEMS interconnection
Semiconductor devices. Micro-electromechanical devices Test method for adhesion strength of metal powder paste in MEMS interconnection
Released: 2021-07-07
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183.28 EUR
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183.28 EUR
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23.20 EUR
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23.20 EUR
BS IEC 60747-5-14:2022
Semiconductor devices Optoelectronic devices. Light emitting diodes. Test method of the surface temperature based on the thermoreflectance method
Semiconductor devices Optoelectronic devices. Light emitting diodes. Test method of the surface temperature based on the thermoreflectance method
Released: 2024-09-26
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255.20 EUR
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255.20 EUR
BS EN IEC 60747-15:2024
Semiconductor devices Discrete devices. Isolated power semiconductor devices
Semiconductor devices Discrete devices. Isolated power semiconductor devices
Released: 2024-12-03
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354.96 EUR
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354.96 EUR