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31.080.01 Semiconductor devices in general
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BS EN IEC 60749-13:2018
Semiconductor devices. Mechanical and climatic test methods Salt atmosphere
Semiconductor devices. Mechanical and climatic test methods Salt atmosphere
Released: 2018-04-30
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189.60 EUR
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189.60 EUR
BS EN 60191-6-19:2010
Mechanical standardization of semiconductor devices Measurement methods of the package warpage at elevated temperature and the maximum permissible warpage
Mechanical standardization of semiconductor devices Measurement methods of the package warpage at elevated temperature and the maximum permissible warpage
Released: 2010-06-30
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189.60 EUR
BS IEC 60747-14-1:2010
Semiconductor devices Semiconductor sensors. Generic specification for sensors
Semiconductor devices Semiconductor sensors. Generic specification for sensors
Released: 2010-04-30
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264.00 EUR
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264.00 EUR
BS EN 60749-25:2003
Semiconductor devices. Mechanical and climatic test methods Temperature cycling
Semiconductor devices. Mechanical and climatic test methods Temperature cycling
Released: 2003-10-30
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BS EN IEC 60749-26:2018
Semiconductor devices. Mechanical and climatic test methods Electrostatic discharge (ESD) sensitivity testing. Human body model (HBM)
Semiconductor devices. Mechanical and climatic test methods Electrostatic discharge (ESD) sensitivity testing. Human body model (HBM)
Released: 2018-04-30
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367.20 EUR
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367.20 EUR
BS EN 60749-38:2008
Semiconductor devices. Mechanical and climatic test methods Soft error test method for semiconductor devices with memory
Semiconductor devices. Mechanical and climatic test methods Soft error test method for semiconductor devices with memory
Released: 2008-06-30
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BS EN 60191-4:2014+A1:2018
Mechanical standardization of semiconductor devices Coding system and classification into forms of package outlines for semiconductor device packages
Mechanical standardization of semiconductor devices Coding system and classification into forms of package outlines for semiconductor device packages
Released: 2018-05-30
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309.60 EUR
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309.60 EUR
BS 3934-5:1997
Mechanical standardization of semiconductor devices Recommendations applying to tape automated bonding (TAB) of integrated circuits
Mechanical standardization of semiconductor devices Recommendations applying to tape automated bonding (TAB) of integrated circuits
Released: 1997-09-15
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PD ES 59008-5-2:2001
Data requirements for semiconductor die. Particular requirements and recommendations for die types Bare die with added connection structures
Data requirements for semiconductor die. Particular requirements and recommendations for die types Bare die with added connection structures
Released: 2001-06-15
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160.80 EUR
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160.80 EUR
BS EN 60749-16:2003
Semiconductor devices. Mechanical and climatic test methods Particle impact noise detection (PIND)
Semiconductor devices. Mechanical and climatic test methods Particle impact noise detection (PIND)
Released: 2004-06-24
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160.80 EUR
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160.80 EUR
English Secure PDF
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160.80 EUR
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In stock
160.80 EUR
English Secure PDF
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189.60 EUR
English Hardcopy
In stock
189.60 EUR