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31.080.01 Semiconductor devices in general
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BS EN 60191-6-10:2003
Mechanical standardization of semiconductor devices General rules for the preparation of outline drawings of surface mounted semiconductor device packages
Mechanical standardization of semiconductor devices General rules for the preparation of outline drawings of surface mounted semiconductor device packages
Released: 2004-03-31
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BS EN 60749-1:2003
Semiconductor devices. Mechanical and climatic test methods General
Semiconductor devices. Mechanical and climatic test methods General
Released: 2003-07-07
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154.10 EUR
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154.10 EUR
PD IEC/TR 63133:2017
Semiconductor devices. Scan based ageing level estimation for semiconductor devices
Semiconductor devices. Scan based ageing level estimation for semiconductor devices
Released: 2018-01-29
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BS EN 60749-4:2017
Semiconductor devices. Mechanical and climatic test methods Damp heat, steady state, highly accelerated stress test (HAST)
Semiconductor devices. Mechanical and climatic test methods Damp heat, steady state, highly accelerated stress test (HAST)
Released: 2017-11-28
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BS EN 62374:2007
Semiconductor devices. Time dependent dielectric breakdown (TDDB) test for gate dielectric films
Semiconductor devices. Time dependent dielectric breakdown (TDDB) test for gate dielectric films
Released: 2008-10-31
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253.00 EUR
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BS EN 62418:2010
Semiconductor devices. Metallization stress void test
Semiconductor devices. Metallization stress void test
Released: 2010-08-31
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BS EN 60749-14:2003
Semiconductor devices. Mechanical and climatic test methods Robustness of terminations (lead integrity)
Semiconductor devices. Mechanical and climatic test methods Robustness of terminations (lead integrity)
Released: 2003-12-15
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BS EN 60749-40:2011
Semiconductor devices. Mechanical and climatic test methods Board level drop test method using a strain gauge
Semiconductor devices. Mechanical and climatic test methods Board level drop test method using a strain gauge
Released: 2011-09-30
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253.00 EUR
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BS EN IEC 60191-1:2018
Mechanical standardization of semiconductor devices General rules for the preparation of outline drawings of discrete devices
Mechanical standardization of semiconductor devices General rules for the preparation of outline drawings of discrete devices
Released: 2018-04-30
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296.70 EUR
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PD IEC TR 63378-1:2021
Thermal standardization on semiconductor packages Thermal resistance and thermal parameter of BGA, QFP type semiconductor packages
Thermal standardization on semiconductor packages Thermal resistance and thermal parameter of BGA, QFP type semiconductor packages
Released: 2022-01-11
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253.00 EUR
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255.30 EUR
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255.30 EUR
English Secure PDF
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181.70 EUR
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181.70 EUR