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31.080.01 Semiconductor devices in general
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BS EN IEC 60749-13:2018
Semiconductor devices. Mechanical and climatic test methods Salt atmosphere
Semiconductor devices. Mechanical and climatic test methods Salt atmosphere
Released: 2018-04-30
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BS EN 60191-6-19:2010
Mechanical standardization of semiconductor devices Measurement methods of the package warpage at elevated temperature and the maximum permissible warpage
Mechanical standardization of semiconductor devices Measurement methods of the package warpage at elevated temperature and the maximum permissible warpage
Released: 2010-06-30
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BS IEC 60747-14-1:2010
Semiconductor devices Semiconductor sensors. Generic specification for sensors
Semiconductor devices Semiconductor sensors. Generic specification for sensors
Released: 2010-04-30
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BS EN 60749-25:2003
Semiconductor devices. Mechanical and climatic test methods Temperature cycling
Semiconductor devices. Mechanical and climatic test methods Temperature cycling
Released: 2003-10-30
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BS 3934-5:1997
Mechanical standardization of semiconductor devices Recommendations applying to tape automated bonding (TAB) of integrated circuits
Mechanical standardization of semiconductor devices Recommendations applying to tape automated bonding (TAB) of integrated circuits
Released: 1997-09-15
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BS EN IEC 60749-26:2018
Semiconductor devices. Mechanical and climatic test methods Electrostatic discharge (ESD) sensitivity testing. Human body model (HBM)
Semiconductor devices. Mechanical and climatic test methods Electrostatic discharge (ESD) sensitivity testing. Human body model (HBM)
Released: 2018-04-30
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13/30290462 DC
BS EN 60191-1. Mechanical standardization of semiconductor devices. Part 1. General rules for the preparation of outline drawings of discrete devices
BS EN 60191-1. Mechanical standardization of semiconductor devices. Part 1. General rules for the preparation of outline drawings of discrete devices
Released: 2013-09-10
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22.40 EUR
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150.08 EUR
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BS EN 60749-16:2003
Semiconductor devices. Mechanical and climatic test methods Particle impact noise detection (PIND)
Semiconductor devices. Mechanical and climatic test methods Particle impact noise detection (PIND)
Released: 2004-06-24
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150.08 EUR
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150.08 EUR
English Secure PDF
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176.96 EUR
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176.96 EUR
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176.96 EUR
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