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31.080.01 Semiconductor devices in general
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BS 3934-5:1997
Mechanical standardization of semiconductor devices Recommendations applying to tape automated bonding (TAB) of integrated circuits
Mechanical standardization of semiconductor devices Recommendations applying to tape automated bonding (TAB) of integrated circuits
Released: 1997-09-15
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BS EN 60749-16:2003
Semiconductor devices. Mechanical and climatic test methods Particle impact noise detection (PIND)
Semiconductor devices. Mechanical and climatic test methods Particle impact noise detection (PIND)
Released: 2004-06-24
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155.44 EUR
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155.44 EUR
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155.44 EUR
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183.28 EUR
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BS EN 60191-4:2014+A1:2018
Mechanical standardization of semiconductor devices Coding system and classification into forms of package outlines for semiconductor device packages
Mechanical standardization of semiconductor devices Coding system and classification into forms of package outlines for semiconductor device packages
Released: 2018-05-30
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PD ES 59008-5-2:2001
Data requirements for semiconductor die. Particular requirements and recommendations for die types Bare die with added connection structures
Data requirements for semiconductor die. Particular requirements and recommendations for die types Bare die with added connection structures
Released: 2001-06-15
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BS EN 62374-1:2010
Semiconductor devices Time-dependent dielectric breakdown (TDDB) test for inter-metal layers
Semiconductor devices Time-dependent dielectric breakdown (TDDB) test for inter-metal layers
Released: 2011-06-30
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13/30290462 DC
BS EN 60191-1. Mechanical standardization of semiconductor devices. Part 1. General rules for the preparation of outline drawings of discrete devices
BS EN 60191-1. Mechanical standardization of semiconductor devices. Part 1. General rules for the preparation of outline drawings of discrete devices
Released: 2013-09-10
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23.20 EUR
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23.20 EUR
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BS QC 750100:1986+A2:1996
Harmonized system of quality assessment for electronic components. Discrete semiconductor devices. Sectional specification
Harmonized system of quality assessment for electronic components. Discrete semiconductor devices. Sectional specification
Released: 2010-01-31
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BS EN IEC 60749-26:2018
Semiconductor devices. Mechanical and climatic test methods Electrostatic discharge (ESD) sensitivity testing. Human body model (HBM)
Semiconductor devices. Mechanical and climatic test methods Electrostatic discharge (ESD) sensitivity testing. Human body model (HBM)
Released: 2018-04-30
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354.96 EUR
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