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31.080.01 Semiconductor devices in general
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BS EN 60749-23:2004+A1:2011
Semiconductor devices. Mechanical and climatic test methods High temperature operating life
Semiconductor devices. Mechanical and climatic test methods High temperature operating life
Released: 2011-06-30
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160.80 EUR
BS EN 60749-27:2006+A1:2012
Semiconductor devices. Mechanical and climatic test methods Electrostatic discharge (ESD) sensitivity testing. Machine model (MM)
Semiconductor devices. Mechanical and climatic test methods Electrostatic discharge (ESD) sensitivity testing. Machine model (MM)
Released: 2013-01-31
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189.60 EUR
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189.60 EUR
BS EN 60749-21:2011
Semiconductor devices. Mechanical and climatic test methods Solderability
Semiconductor devices. Mechanical and climatic test methods Solderability
Released: 2011-08-31
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264.00 EUR
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264.00 EUR
PD ES 59008-6-2:2001
Data requirements for semiconductor die. Exchange data formats and data dictionary Data dictionary
Data requirements for semiconductor die. Exchange data formats and data dictionary Data dictionary
Released: 2001-06-15
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264.00 EUR
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264.00 EUR
BS EN 60749-31:2003
Semiconductor devices. Mechanical and climatic test methods Flammability of plastic-encapsulated devices (internally induced)
Semiconductor devices. Mechanical and climatic test methods Flammability of plastic-encapsulated devices (internally induced)
Released: 2003-07-04
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160.80 EUR
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264.00 EUR
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264.00 EUR
BS IEC 60747-14-2:2000
Discrete semiconductor devices and integrated circuits. Semiconductor devices. Semiconductor sensors Hall elements
Discrete semiconductor devices and integrated circuits. Semiconductor devices. Semiconductor sensors Hall elements
Released: 2001-05-15
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BS IEC 62951-5:2019
Semiconductor devices. Flexible and stretchable semiconductor devices Test method for thermal characteristics of flexible materials
Semiconductor devices. Flexible and stretchable semiconductor devices Test method for thermal characteristics of flexible materials
Released: 2019-03-05
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PD ES 59008-5-3:2001
Data requirements for semiconductor die. Particular requirements and recommendations for die types Minimally-packaged die
Data requirements for semiconductor die. Particular requirements and recommendations for die types Minimally-packaged die
Released: 2001-12-05
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BS EN IEC 60749-15:2020
Semiconductor devices. Mechanical and climatic test methods Resistance to soldering temperature for through-hole mounted devices
Semiconductor devices. Mechanical and climatic test methods Resistance to soldering temperature for through-hole mounted devices
Released: 2020-10-01
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BS EN IEC 60749-30:2020
Semiconductor devices. Mechanical and climatic test methods Preconditioning of non-hermetic surface mount devices prior to reliability testing
Semiconductor devices. Mechanical and climatic test methods Preconditioning of non-hermetic surface mount devices prior to reliability testing
Released: 2020-09-30
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BS IEC 62779-4:2020
Semiconductor devices. Semiconductor interface for human body communication Capsule endoscope
Semiconductor devices. Semiconductor interface for human body communication Capsule endoscope
Released: 2020-07-17
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189.60 EUR
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189.60 EUR