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>UNE standards>UNE EN 62047-18:2013 - Semiconductor devices - Micro-electromechanical devices - Part 18: Bend testing methods of thin film materials (Endorsed by AENOR in November of 2013.)
in stockReleased: 2013-11-01
UNE EN 62047-18:2013 - Semiconductor devices - Micro-electromechanical devices - Part 18: Bend testing methods of thin film materials (Endorsed by AENOR in November of 2013.)

UNE EN 62047-18:2013

Semiconductor devices - Micro-electromechanical devices - Part 18: Bend testing methods of thin film materials (Endorsed by AENOR in November of 2013.)

Dispositivos semiconductores. Dispositivos micro-electromecánicos. Parte 18: Métodos de ensayo de doblado para materiales de película fina. (Ratificada por AENOR en noviembre de 2013.)

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Standard number:UNE EN 62047-18:2013
Pages:17
Released:2013-11-01
Status:Standard
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UNE EN 62047-18:2013